Full Specification Given Below:
| Standard | BS EN 60068-2-58:2004 |
| Title Identifier | Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| Status | CU |
| Publication Date | 19/11/04 |
| Committee | EPL/501 |
| Approximate Price | £92.00 |
| Notes | |
| ISBN | 0 580 44773 1 |
| Pages | 30 |
| International Equivalent | EN 60068-2-58:2004 IEC 60068-2-58:2004 |
| Descriptors | Environmental testing, Electrical components, Electrical equipment, Electronic equipment and components, Solderability testing, Chemical-resistance tests, Thermal resistance, Heating tests, Thermal testing, Surfaces, Testing conditions, Grades (quality), Visual inspection (testing) |
| Cross references | IEC 60068-1:1988, IEC 60068-2-20:1979, IEC 60194:1999, IEC 60749-20:2002, IEC 61190-1-1:2002, IEC 61190-1-2:2002, IEC 61190-1-3:2002, IEC 61191-2:1998, IEC 61249-2-7:2002, IEC 61760-1:1998, EN 60068-1:1994, CENELEC HD 323.2.20 S3:1988, EN 60749-20:2003, EN 61190-1-1:2002, EN 61190-1-2:2002, EN 61190-1-3:2002, EN 61191-2:1998, EN 61249-2-7:2002, EN 61760-1:1998, IEC 60068-2-44:1995, IEC 60068-2-54:1985, IEC 60068-2-69:1995 |
| Replaces | BS EN 60068-2-58:1999 |
| Replaces Notes | |
| Replaced By | |
| Replaced by Notes |
