BS EN 60249-1:1993

BS EN 60249-1:1993


Full Specification Given Below:

Standard BS EN 60249-1:1993
Title Identifier Base materials for printed circuits. Base materials for printed circuits. Test methods
Status CU
Publication Date 29/07/83
Committee EPL/501
Approximate Price 106.00
Notes
ISBN 0 580 13343 5
Pages 48
International Equivalent EN 60249-1:1993 IEC 60249-1:1982
Descriptors Printed-circuit bases, Printed-circuit boards, Printed circuits, Electronic equipment and components, Coated materials, Metal coatings, Copper, Sheet materials, Laminates, Films (states of matter), Foil, Specimen preparation, Test specimens, Dimensions, Electrical testing, Resistance measurement, Corrosion tests, Humidity, Environmental testing, Damp-heat tests, Tracking tests, Permittivity measurement, Dissipation factor, Dielectric-strength tests, Thermal testing, Mechanical testing, Dimensional changes, Dimensional measurement, Strength of materials, Surface defects, Peeling tests, Adhesion tests, Thermal-shock tests, Blistering, Visual inspection (testing), Solderability testing, Bend testing, Fatigue testing, Weight measurement, Flammability, Fire tests, Test equipment, Sample location, High-temperature testing, Flatness measurement, Density measurement, Thickness measurement
Cross references BS 410, BS 903, BS 2011:Part 1.1, BS 2011:Part 2.1B, BS 2011:Part 2.1Ca, BS 2011:Part 2.1T, BS 2067, BS 2782:Part 3:Method 335A, BS 2782:Part 4:Methods 430A to 430D, BS 2918, BS 3203, BS 4542, BS 4584:Part 11, BS 5735, BS 6233, ISO/R 1326, IEC 194
Replaces
Replaces Notes
Replaced By
Replaced by Notes


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