BS EN 60749-20:2003

BS EN 60749-20:2003


Full Specification Given Below:

Standard BS EN 60749-20:2003
Title Identifier Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Status CU
Publication Date 07/07/03
Committee EPL/47
Approximate Price 92.00
Notes
ISBN 0 580 42197 X
Pages 28
International Equivalent EN 60749-20:2003 IEC 60749-20:2002
Descriptors Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Climate, Plastics, Encapsulated, Surface mounting devices, Thermal testing, Soldering, Solderability testing, Damp-heat tests
Cross references IEC 60068-2-20:1979, IEC 60749-3, CENELEC HD 323.2.20 S3:1988, EN 60749-3:2002
Replaces BS EN 60749:1999
Replaces Notes Partially replaces BS EN 60749:1999.
Replaced By
Replaced by Notes


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