BS 4584-103.1:1990

BS 4584-103.1:1990


Full Specification Given Below:

Standard BS 4584-103.1:1990
Title Identifier Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
Status CU
Publication Date 28/02/90
Committee EPL/501
Approximate Price 32.00
Notes
ISBN 0 580 18172 3
Pages 12
International Equivalent IEC 60249-3-1:1981
Descriptors Printed-circuit bases, Printed-circuit boards, Printed circuits, Impregnated materials, Epoxy resins, Reinforced materials, Textile glass, Woven fabrics, Laminates, Sheet materials, Bonding, Defects, Flammability, Permittivity, Dissipation factor, Dielectric strength, Rolls, Packaging, Marking, Sample location, Volatile matter determination, Determination of content, Specimen preparation, Testing conditions, Heating tests, Flow measurement, Test specimens, Thickness measurement, Gelation, Time measurement, Flameproof materials
Cross references BS 4584:Part 1
Replaces BS 4584:Part 11:1977
Replaces Notes
Replaced By
Replaced by Notes


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